MPi Canteliver Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is commonly used on gold bump and pad wafer testing for Exhibit driver, logic, and memory device. MPI’s cantilever probes are definitely the corresponding solution on the requires of fi­ne pitch, small pad dimension, large pace, less cleaning, multi-DUT, higher pin rely, and extremely-low leakage specifications. With exceptional craftsmanship, ground breaking architecture and proven methodologies according to mechanical and electrical simulation/measurement final results, producing MPI the very best cantilever supplier around the world.


FCB Probe Card

The FCB Probe Card is considered the most experienced technological innovation of buckling beam probe card. It truly is aimed to accomplish the semiconductor ship manufacture time-to-current market (TTM) and value of examination (COT) need. FCB can be a verified Remedy for many different semiconductor manufacturing tests from early engineering pilot-operates to significant quantity manufacturing (HVM). FCB is prepared for product necessitating large signal integrity probing (SI) and/or ability integrity probing (PI). Purposes incorporate reducing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and much more. FCB assures the earth’s ideal General cost-of-possession (COO) for numerous DUT purposes.


EVS Probe Card

The EVS Probe Card is really an enhancement around the traditional buckling beam probe card. Key options are increased current carrying ability (C.C.C.) and reduced well balanced Make contact with drive (BCF), and also overall MEMS-like features. EVS can easily meet up with the need of Innovative wafer probing. Specific alignment and outstanding planarity Command are classified as the key variables contributing to secure Get in touch with resistance. With its ability and performance, EVS Probe Card is an excellent option for Sophisticated probe cards.


Osprey probe card

The Osprey probe card is MPI’s Alternative to click here demand for ever finer pitch. It truly is suitable for smaller Al pad, and is also perfect for very small pitch software with peripheral and full array pattern. With precise alignment and greater planarity Command, Osprey can attain larger productiveness by multi-DUT style and design.  The forming wire (FW) type needle made with MPI’s possess micro fabrication course of action don't just provides high-high quality efficiency but in addition makes it possible for uncomplicated needle substitution and shortens protecting cycle time.



Kestrel Probe Card

The Kestrel Probe Card is provided with MEMS wire (MW) needle which happens to be suitable for the demand from customers of small drive probing. It also comes with a chance to fulfill significant C.C.C. and significant pin counts software. The MEMS method assures very steady needle traits, and also the special composition structure allows precise alignment and planarity control.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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